Koch Chemie One-Cut Pad Size:6in. robust construction to maximize performance

robust construction to maximize performance when used on a forced rotation machine polisher

Apply polishing compound at medium speed and with medium pressure

Saves time thanks to one-step polishing process

The FLEX XC3401 VRG buffer effectively removes swirls

Flex Foam Backing Plates utilize a flexible foam interface that conforms and adapts to curved surfaces with ease delivering consistent results time after time

Koch Chemie One-Cut Pad Size:6in. robust construction to maximize performanceMedium abrasive sponge for removing moderate weathering and scratches using the One Cut and Finish P6. 01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contributes to a high level of abrasiveness and excellent hygiene