OEM-43T-TF more activity ultra-low voiding resin-based water-soluble MT soldering tacky paste flux (REL0) Variants Mtº-624 - Sn62

Mtº-624 - Sn62

quick and efficient soldering/desoldering and effortless cleaning with IPA

critical for aerospace-grade electronics

BGA solder sphere slumping is a defect that occurs during the reflow soldering process

Implement quality control measures: Regularly inspect solder joints for defects and take corrective actions as needed

OEM-43T-TF more activity ultra-low voiding resin-based water-soluble MT soldering tacky paste flux (REL0) Variants Mtº-624 - Sn62OEM 43T TF resin based MT water soluble soldering tacky paste flux for mid temperature leaded soldering. Ultra low voiding, easy to clean minimum regulatory burden and low maintenance. See how OEM 43T TF compares to other fluxes on the market Subject OEM 43T TF OEM 45T TF Classification REL0 REL0 Cleaning DI water DI water Voiding Low Low QC Aid No Yes OEM 45T TF glows in UV for instant visual QC certification "QC Aid Everyone Can QC" OEM 45T TF has