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QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D It is professionally used for

QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D It is professionally used for

Name: QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D It is professionally used for
Brand: armz-ageddon.com
SKU: 67628345992
Price: 11.81 USD
Availability: InStock
Rating: 4.7443 (29 reviews)

SKU: 67628345992

4.7

USD11.81 USD41.81

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Ships within 48 hours · Estimated delivery Aug 7 - Aug 12

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QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net option:A9 CPU RAM 3D It is professionally used forPRODUCT INTRODUCTION Place of Origin: Guangdong, China(Mainland) Brand Name: QianLi Model Number: 3D Android Black Stencil MSM 8937 2AA Material: Aluminum PRODUCT FEATURES Description: Quanli 3D Android Black Stencil MSM 8937 2AAQualcomm Snapdragon Function: Reballing IC pins

Store: armz-ageddon.com · Domain: armz-ageddon.com

Description

It is professionally used for tin planting of iPhone series mobile phone chips such as A8 A9 A10 A11 A12 A13 A14 A14S

This is an high quality and ready-to-install replacement screen assembly for Honor 8S

Laser Power: 1500mW

more flexible

rear smoking device

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